Package
Chip-on-Board packaging with wire-bonding and flip-chip technology for high-density, high-reliability smart card modules.
Package
PAYIT delivers a complete Chip-on-Board (COB) packaging lineup — from 6/8-pin contact modules to flip-chip, coil-on-module, and pure contactless designs. Each module is built on precise die-attach, wire-bonding, and encapsulation processes for the highest reliability. Each module is built on precise die-attach, wire-bonding, and encapsulation processes for the highest reliability. PAYIT delivers a complete Chip-on-Board (COB) packaging lineup — from 6/8-pin contact modules to flip-chip, coil-on-module, and pure contactless designs. Each module is built on precise die-attach, wire-bonding, and encapsulation processes for the highest reliability. In addition, we are equipped with a flip chip packaging process that eliminates the need for wire bonding and encapsulation.
Contact
6 & 8 PINDual
Inductive / ConductiveFlip
Coil on Module / DIAContactless
Coil on Module / Pure CL
Package Lineup
A full range of COB module types optimized for contact, dual-interface, and contactless cards.
6 PIN (Gold, Silver)
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Tape
- PCB type, 205±5µm
- Die Attach
- Epoxy type
- Wire
- Au 0.8 ~ 1.0 mil
- Encap
- Dam & Fill, Fill Only
8 PIN (Gold, Silver)
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Tape
- PCB type, 205±5µm
- Die Attach
- Epoxy type
- Wire
- Au 0.8 ~ 1.0 mil
- Encap
- Dam & Fill, Fill Only
Flip (Gold, Silver)
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Tape
- PCB, PI type, 200, 260, 320±5µm
- Die Connect
- ACP, NCP
Coil on Module
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Tape
- PCB, PI type, 100~205±5µm
- Die Connect
- Wire or Flip
Designed Chip
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Reference
- Toss Bank, Hyundai Card, Metal Card
- Tape
- PCB type, 205±5µm
- Encap
- Dam & Fill, Fill Only
Pure Contactless
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Tape
- Lead frame 60µm
- Die Connect
- Wire or Flip
- Total Thickness
- 205 ~ 350 µm
Contact Chip
COB- Wafer
- Infineon, STM, Samsung, NXP etc.
- Tape
- PCB type, 205±5µm
- Wire
- Au 0.8 ~ 1.0 mil
- Encap
- Dam & Fill, Fill Only
Need a Custom Package?
We propose the optimal COB module design tailored to your wafer, tape, and connection requirements. Talk to PAYIT's engineering team.
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